[{"data":1,"prerenderedAt":-1},["ShallowReactive",2],{"cms-page-pcba-sub-capability-en-US":3},[4,14,40,66,89,106],{"blockKey":5,"sortNo":6,"blockTitle":7,"blockType":8,"content":9},"hero",1,"Hero 主文案","line-hero",{"desc":10,"lead":11,"stats":12,"title":13,"heroNum":11,"updated":11,"heroUnit":11,"subtitle":11,"priceFrom":11,"heroNumDesc":11,"heroNumLabel":11},"Detailed process envelope: package range, precision placement, soldering processes and the complete test system behind every order.","",[],"SMT\u002FTHT Capability----",{"blockKey":15,"sortNo":16,"blockTitle":17,"blockType":18,"content":19},"specs",2,"工艺参数大表","kv-rows",{"desc":11,"rows":20,"title":39},[21,24,27,30,33,36],{"label":22,"value":23},"Smallest Package","01005 \u002F 0201",{"label":25,"value":26},"Min. BGA Pitch","0.25 mm",{"label":28,"value":29},"Placement Accuracy","+\u002F-25 um",{"label":31,"value":32},"Max. Panel Size","460 x 360 mm",{"label":34,"value":35},"THT Processes","Wave \u002F selective \u002F manual",{"label":37,"value":38},"Inspection","SPI + AOI + X-ray","Process Parameters at a Glance",{"blockKey":41,"sortNo":42,"blockTitle":43,"blockType":44,"content":45},"checks",3,"检验与测试体系","icon-cards",{"items":46,"title":64,"subtitle":65},[47,52,56,60],{"desc":48,"icon":49,"title":50,"visible":51},"3D SPI verifies paste thickness and alignment, catching issues before placement.","fas fa-fill-drip","SPI Paste Inspection",true,{"desc":53,"icon":54,"title":55,"visible":51},"Post-reflow full inspection for offset, tombstones, polarity and bridges.","fas fa-eye","100% AOI",{"desc":57,"icon":58,"title":59,"visible":51},"BGA and QFN joints verified by X-ray sampling - hidden joints fully covered.","fas fa-x-ray","X-ray Sampling",{"desc":61,"icon":62,"title":63,"visible":51},"In-circuit and functional testing available, executed per your test plan.","fas fa-plug","ICT · FCT","Inspection & Test System","Standard inspection gates on every order, expandable to your test plan.",{"blockKey":67,"sortNo":68,"blockTitle":69,"blockType":70,"content":71},"process",4,"流程时间线","steps",{"items":72,"title":88,"subtitle":11},[73,76,79,82,85],{"desc":74,"icon":11,"title":75,"visible":51},"Complex boards reviewed by engineers before production","Engineer Review",{"desc":77,"icon":11,"title":78,"visible":51},"Laser stencil with 3D solder paste inspection","Solder Paste & SPI",{"desc":80,"icon":11,"title":81,"visible":51},"High-speed placement with nitrogen reflow","Placement & Reflow",{"desc":83,"icon":11,"title":84,"visible":51},"Wave \u002F selective soldering for through-hole","THT & Soldering",{"desc":86,"icon":11,"title":87,"visible":51},"100% AOI, ICT\u002FFCT on request","AOI & Testing","Service Process",{"blockKey":90,"sortNo":91,"blockTitle":92,"blockType":93,"content":94},"faq",5,"高频 FAQ","faq-items",{"items":95,"title":105},[96,99,102],{"a":97,"q":98,"visible":51},"SPI on paste, 100% AOI after reflow, and X-ray sampling on BGA\u002FQFN joints. ICT\u002FFCT can be added per your test plan.","What inspection do you perform by default?",{"a":100,"q":101,"visible":51},"Yes, mixed assembly is our standard flow: reflow first, then wave\u002Fselective soldering or hand soldering.","Can you handle mixed SMT and through-hole?",{"a":103,"q":104,"visible":51},"All standard processes are RoHS lead-free; leaded processes are available for specific legacy requirements.","Do you support lead-free processes?","Frequently Asked Questions",{"blockKey":107,"sortNo":108,"blockTitle":109,"blockType":107,"content":110},"cta",6,"CTA 收尾横幅",{"desc":111,"icon":11,"bgImg":11,"title":112,"btnHref":113,"btnLabel":114},"Send Gerber + BOM and get a complete PCBA quote within 24 hours.","Ready to assemble your boards?","quote:smt","Get Quote"]