HDI Boards
High-density interconnect for fine-pitch BGAs and compact layouts: laser microvias, stacked-via structures and 3/3 mil fine lines with ENIG as standard.
| Largeur/espace de piste min. | 3/3 mil |
| Diamètre de microvia laser | 0.10 mm |
| Diamètre de perçage mécanique | 0.15 mm |
| Pastille minimale | 0.25 mm |
| Pas BGA minimal | 0.25 mm |
What is an HDI Board
HDI (High Density Interconnect) uses laser microvias, blind/buried vias and fine lines to achieve higher routing density on limited board area - the inevitable choice for sub-0.4mm-pitch BGAs and compact structural designs.
| Core Features | Laser microvias (≤0.15mm) + blind/buried vias |
| Stack-up Notation | 1+N+1 / 2+N+2 / 3+N+3 (N = mechanical layers) |
| Via Processes | Stacked / staggered vias, resin plugging + electroplated capping |
| Common Materials | Panasonic M6 / EMC TU-872 / Shengyi S7439G |
| Surface Finish | ENIG (standard) / OSP (after engineering review) |
| Typical Uses | Phones, modules, CPU/FPGA carriers, optical modules |
Choose the Build-up by BGA Pitch
The build-up grade determines fanout capability and cost - match it to your package requirements.
0.4mm Pitch
1st-order HDI- 1+N+1 with single-side laser microvias
- The most cost-effective high-density option
- Best for: modules, mid-range phone sub-boards
0.35mm Pitch
2nd-order HDI- 2+N+2 staggered/stacked via structure
- Copper-filled vias take density one level higher
- Best for: flagship phones, optical modules
0.25mm Pitch
Any-layer HDI- 3+N+3 laser interconnect on every layer
- Carrier-grade capability for advanced chips
- Best for: AP/SOC carriers, high-speed computing
Build-up Capability Ladder
From entry-level HDI to any-layer interconnect — step up as your integration needs grow.
Entry HDI
Single-side laser microvias, the most cost-effective high-density option for 0.4mm pitch BGAs.
Stacked Via HDI
Staggered/stacked vias with copper filling for denser routing, supporting 0.35mm pitch.
Any-layer HDI
Laser interconnect on every layer for 0.25mm pitch BGAs and advanced chip carriers.
Product Showcase
Standard HDI Cases (1st-2nd Order)
8-Layer Phone Sub-Board (1+N+1)
6-Layer Wi-Fi Module Board (1+N+1)
10-Layer Smartwatch Board (2+N+2)
4-Layer TWS Earbud Board (1+N+1)
Any-layer / Advanced Cases
16-Layer Any-layer HDI Board
14-Layer Any-layer Baseband Board
12-Layer High-Speed Computing Carrier
8-Layer Any-layer RF Module Board
Manufacturing Capabilities
Standard manufacturing capability range for this product line. Contact our engineers to evaluate special requirements.
| Build-up | 1+N+1 to 3+N+3 (any-layer) |
| Laser Microvia Dia. | 0.10 mm |
| Mechanical Drill Dia. | 0.15 mm |
| Min. Trace/Space | 3/3 mil |
| Min. Pad Size | 0.25 mm |
| Min. BGA Pitch | 0.25 mm |
| Via Plugging | Resin plugging + electroplated capping |
| Surface Finish | ENIG (standard) / OSP |
| Board Thickness | 0.4 - 2.4 mm |
| Quality Standard | IPC Class 2 (Class 3 optional) |
Lead Time & Pricing Highlights
Density built for advanced packages
Laser Microvias
0.10mm laser-drilled microvias for dense BGA fanout.
Stacked Vias
Stacked and staggered via structures with copper filling.
Fine Lines
3/3 mil line/space for high routing density.
Typical Applications
Smart Devices
Smartphones, tablets and wearables with compact form factors.
Optical Modules
Camera modules and optical transceivers requiring high density.
High-end Computing
CPU/FPGA carrier boards with 0.25-0.4mm pitch BGAs.
Networking
High-speed switch and 5G small-cell boards.
From Gerber to delivery in four steps
Upload Files
Send Gerber/ODB++ and stack-up table; standard boards get instant pricing.
Review & Quote
Complex boards get an engineer review before quoting.
Confirm Production
Confirm specs and price, pay online, and your boards enter the production queue.
Test & Deliver
Flying probe/fixture testing on every board with reports, shipped worldwide.
Further Reading
For more PCB process knowledge and technical practice, visit our blog center.
