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Rigid-Flex Boards111

FR-4 rigid sections and PI flex sections laminated as one board: no connectors, no mating solder joints, more compact 3D assembly and higher reliability - the premium choice for AR/VR, medical and automotive products.

Get QuoteQuoted by stack-up· 12 - 15 days
Rigid-Flex Boards

What is a Rigid-Flex Board

A rigid-flex board laminates rigid FR-4 sections and flexible PI sections into a single board, replacing the "FPC + connector + rigid board" assembly - fewer interconnects mean fewer failure points, making it ideal for products with tight space and demanding bend reliability.

StructureFR-4 rigid sections + PI flex sections, laminated as one
Stack-up Notatione.g. 2R+4F+2R (rigid-flex-rigid)
Bend-Area DesignBend radius ≥ 6-10x total flex thickness
Common MaterialsDuPont PI + FR-4 hybrid stack-up
Key AdvantageNo connectors, fewer solder joints, 3D assembly
Typical UsesAR/VR, medical wearables, automotive, industrial cameras

Three Critical Zones of a Rigid-Flex Board

One rigid-flex board = rigid carrier zone + flexible bend zone + reliable transition zone; together they determine the reliability of the whole board.

Rigid Zone

FR-4 laminated area carrying components and pads, supporting high layer counts and impedance control.

Flex Zone

PI film area with no routing inside the bend; copper traces sit on the neutral axis to spread stress.

Transition Zone

Rigid-flex lamination boundary with gradual layer transitions and rounded openings to prevent stress tearing.

Rigid-Flex vs FPC + Connector

Each option fits different scenarios - weigh reliability, space and cost to choose.

FPC + Connector

Traditional
  • Connectors take up space and add BOM cost
  • Mating solder joints are the weak link for reliability
  • Best for: low-cost designs that need disassembly

Rigid-Flex

High Reliability
  • Zero connectors, zero mating solder joints
  • Simplified assembly completed in a single SMT pass
  • Best for: high-reliability, ultra-compact products

Design Support

Engineer Review
  • Bend-area keep-out routing and layer-transition design
  • Free stack-up review and feasibility analysis
  • Start with just Gerber + stack-up table

Product Showcase

Standard Rigid-Flex Cases (4-8 Layers)

6-Layer Medical Probe Rigid-Flex Board

6-Layer Medical Probe Rigid-Flex Board

MaterialDuPont PI + S1000-2MLayers6 Layers (2R+2F+2R)Thickness0.6mmCopper1 ozSurface FinishENIGIndustryMedical Devices
8-Layer Industrial Camera Rigid-Flex Board

8-Layer Industrial Camera Rigid-Flex Board

MaterialPI + IT-180ALayers8 Layers (3R+2F+3R)Thickness1.0mmCopper1 ozSurface FinishENIGIndustryIndustrial Vision
4-Layer Sensor Belt Rigid-Flex Board

4-Layer Sensor Belt Rigid-Flex Board

MaterialPI + KB-6160Layers4 Layers (1R+2F+1R)Thickness0.4mmCopper0.5 ozSurface FinishENIGIndustryWearables
10-Layer Industrial Touchscreen Rigid-Flex Board

10-Layer Industrial Touchscreen Rigid-Flex Board

MaterialPI + IT-180ALayers10 Layers (3R+4F+3R)Thickness1.2mmCopper1 ozSurface FinishENIGIndustryIndustrial Display

Ultra-Thin / HDI Rigid-Flex Cases

AR Glasses Ultra-Thin Rigid-Flex Board

AR Glasses Ultra-Thin Rigid-Flex Board

MaterialPI SF202 + S1000-2MLayers4 LayersThickness0.35mmCopper0.5 ozSurface FinishENIGIndustryAR/VR
8-Layer HDI Automotive Radar Rigid-Flex Board

8-Layer HDI Automotive Radar Rigid-Flex Board

MaterialPI + S1000-2MLayers8 Layers (2R+4F+2R)Thickness1.03mmCopper1 ozSurface FinishENIGIndustryAutomotive Electronics
6-Layer TWS Earbud Charging Case Board

6-Layer TWS Earbud Charging Case Board

MaterialPI + M6 gradeLayers6 Layers (2R+2F+2R)Thickness0.8mmCopper1 ozSurface FinishENIGIndustryConsumer Electronics
6-Layer Medical Endoscope Rigid-Flex Board

6-Layer Medical Endoscope Rigid-Flex Board

MaterialPI SF201 + S1000-2MLayers6 Layers (2R+2F+2R)Thickness0.7mmCopper0.5 ozSurface FinishENIGIndustryMedical Devices

Manufacturing Capabilities

Standard manufacturing capability range for this product line. Contact our engineers to evaluate special requirements.

Total Layers4 - 12 layers
Flex Layers2 - 6 layers
Board Thickness0.3 - 2.0 mm (tolerance ±10%)
Min. Bend Radius≥ 6x total flex-area thickness
Min. Trace/Space3.5/3.5 mil (flex area 4/4 mil)
Min. Hole Size0.2 mm (plated vias in flex area)
Surface FinishENIG (standard)
Quality StandardIPC-6013 Class 2 (Class 3 optional)

Lead Time & Pricing Highlights

One-piece lamination that bends without breaking

Zero Connectors

Eliminates FPC connectors and mating joints, cutting interconnect failure points by more than 50%.

Compact 3D Assembly

Flex sections fold freely to fit irregular spaces and folding structures.

Bend Reliability

Neutral-axis flex design verified against IPC-6013 bend reliability requirements.

Simplified Assembly

The whole board is assembled in one SMT pass - no mating steps or manual labor.

Typical Applications

AR / VR Devices

Ultra-thin rigid-flex links between optics and main boards in compact curved spaces.

Medical Devices

Bend circuits for endoscope probes, hearing aids and body-worn monitors.

Automotive Electronics

Vibration-resistant interconnects for steering-wheel buttons, radar and displays.

Industrial Cameras

Stable flexible connections between lens modules and image sensors.

From Gerber to delivery in four steps

01

Upload Files

Send Gerber/ODB++ and stack-up table; standard boards get instant pricing.

02

Review & Quote

Complex boards get an engineer review before quoting.

03

Confirm Production

Confirm specs and price, pay online, and your boards enter the production queue.

04

Test & Deliver

Flying probe/fixture testing on every board with reports, shipped worldwide.

Further Reading

For more PCB process knowledge and technical practice, visit our blog center.

View All Articles

Frequently Asked Questions

Rigid-flex requires multiple FR-4/PI lamination cycles, tight layer-to-layer registration and separate flex formation - 3-5 more process steps than FPC. But once connectors and assembly labor are eliminated, total system cost is often lower.
For dynamic bending, at least 6-10x the total flex thickness; for static bending, 3-6x. Our engineers will give specific advice during the stack-up review.
Gerber/ODB++ plus a stack-up table marking rigid/flex zones and layer counts. If you do not have a stack-up table, share your requirements and our engineers will help design it.
Yes. Small-batch prototypes are available to verify bend reliability before volume production; prototypes and volume share the same process flow.
Yes. The flex area supports laser microvias and plated holes; 8-layer HDI rigid-flex (2R+4F+2R) is a proven, common stack-up.
Usually 12-15 days depending on layer count and lamination cycles; allow 1-2 extra days for stack-up review on first orders.

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