Process Capabilities
| Item | Capability | Details |
|---|---|---|
| 基本参数 | ||
| 11 | 22 | 33 |
| 线路参数 | ||
| 11 | 22 | 33 |
| 22 | 33 | 44 |
| 44 | 55 | 66 |
Advanced Capabilities
Purpose-built for high-frequency, high-speed and high-density designs that go beyond standard processes.
HDI (High-Density Interconnect)
1-4 order HDI with 0.1mm minimum laser microvia; both stacked and staggered via structures are production-ready.
Impedance Control
±10% single-ended impedance tolerance (±5% optional), with impedance simulation and first-article TDR test reports.
Blind/Buried Vias & Back Drilling
Blind and buried vias, resin plugging and back drilling for signal integrity on high layer-count boards.
PCB Assembly Capabilities
Full SMT / DIP assembly flow — from 01005 to 0.35mm-pitch BGA — supporting rapid prototyping and low-volume production.
SMT/THT CapabilityPlacement
01005 / 0201 micro parts, QFN, QFP, BGA (≥0.35mm) and fine-pitch odd-form components.
Soldering Processes
Nitrogen reflow, wave and selective wave soldering, plus precision hand soldering for mixed technology.
Test & Inspection
SPI / AOI / X-Ray / ICT / flying probe / FCT functional testing with full first-article inspection.
Component Sourcing
Authorized-channel sourcing with alternates and BOM cost optimization.
Production Process11
Standardized workflow ensures product quality22
开料11
根据订单尺寸切割板材
钻孔22
根据订单尺寸切割板材22
Quality Control
Strict quality inspection system ensures every PCB meets standards
IQC来料检验33
对所有原材料进行严格检验，确保材料质量符合标准
IPQC过程检验44
生产过程中多道工序检验，及时发现和纠正问题