FR-4 Multilayer Boards
The workhorse line from prototype to volume: 1 pc minimum, 24-hour expedited shipping, volume pricing from 100 pcs, IPC Class 2 as standard.
HDI Boards
High-density interconnect for fine-pitch BGAs and compact layouts: laser microvias, stacked-via structures and 3/3 mil fine lines with ENIG as standard.
High-Frequency & High-Speed Boards
Full coverage of Rogers, PTFE and low-loss high-speed materials: from RF antennas and mmWave radar to high-speed switch backplanes. Rogers+FR-4 hybrid stack-up cuts cost, with impedance tolerance ±10% (±7% available).
Flexible PCB (FPC)
Single/double-sided and multilayer FPC with PI or PET base: dynamic bending, tight bend radii and stiffener options supported.
Rigid-Flex Boards
FR-4 rigid sections and PI flex sections laminated as one board: no connectors, no mating solder joints, more compact 3D assembly and higher reliability - the premium choice for AR/VR, medical and automotive products.
Metal-Core Boards (Aluminum / Copper)
Aluminum base at 1-3W/(m·K) and high-conductivity copper base in one line: the standard answer for LED lighting, with thermoelectric-separation copper base boards for concentrated high-power heat.