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PCB Expert

Flexible PCB (FPC)

Single/double-sided and multilayer FPC with PI or PET base: dynamic bending, tight bend radii and stiffener options supported.

Get QuoteFrom $66· 7 - 10 days
Flexible PCB (FPC)
  • 0.5mmMin. bend radius (static)
  • 100kcyclesDynamic flex life (typical)
  • 0.05mmThinnest base thickness

What is an FPC

FPC uses polyimide (PI) or PET film as the base material - bendable, conformable to curved surfaces and only one-third the weight of FR-4 of the same area - widely used in display, battery and camera flex assemblies and wearables.

Base MaterialPI (200℃+ heat resistance) / PET (lower cost)
StructureCoverlay + base film + copper foil (RA copper for better bending)
TypesAdhesive PI (economical) / adhesiveless PI (longer flex life)
StiffenersPI / FR4 / steel + PSA adhesive backing
Surface FinishENIG / electroplated gold (gold fingers) / selective gold
Typical UsesFlex assemblies, wearables, automotive, robot joints

Choose the Structure by Bend Grade

Bend requirements determine the base material, copper foil type and stack-up - confirm the bending mode before selecting materials.

Static Bending

Formed at installation
  • Bend radius ≥ 3x board thickness
  • Adhesive PI + ED copper is sufficient
  • Typical: flex assemblies, display connections

Dynamic Bending

Repeated motion
  • Bend radius ≥ 6x board thickness
  • Adhesiveless PI + RA copper
  • Typical: flip phones, sliding rails, joints

Million-Cycle Grade

Ultra-high life
  • Bend radius ≥ 10x board thickness
  • Neutral-axis trace design
  • Typical: print heads, automotive antennas

Choosing the Right PI Base

Two mainstream flex copper-clad laminates — balance flex grade, temperature rating and cost.

Adhesive PI

Cost-effective
  • Lower cost, assembly-friendly
  • Stable peel strength for static bending
  • Best for: consumer electronics, display & battery flex
  • Dynamic flex life: tens of thousands of cycles

Adhesiveless PI

High performance
  • Thinner and more flexible with stronger bend endurance
  • Higher temperature rating for lead-free reflow and harsh use
  • Best for: dynamic bending, wearables, automotive
  • Dynamic flex life: 100k+ cycles

Product Showcase

Static Bending Cases (Flex Assemblies)

2-Layer Phone Battery Flex

2-Layer Phone Battery Flex

MaterialAdhesive PILayers2 LayersThickness0.12mmCopper0.5 ozSurface FinishENIGIndustryConsumer Electronics
1-Layer Display Connection Flex

1-Layer Display Connection Flex

MaterialAdhesive PILayers1 LayerThickness0.1mmCopper0.5 ozSurface FinishENIGIndustryDisplay Modules
4-Layer Camera Module FPC

4-Layer Camera Module FPC

MaterialAdhesiveless PILayers4 LayersThickness0.2mmCopper0.5 ozSurface FinishENIGIndustryOptical Modules
2-Layer Speaker Audio Flex

2-Layer Speaker Audio Flex

MaterialAdhesive PILayers2 LayersThickness0.13mmCopper0.5 ozSurface FinishENIGIndustryAcoustic Modules

Dynamic Bending Cases (Motion)

4-Layer Fitness Band Main Flex

4-Layer Fitness Band Main Flex

MaterialAdhesiveless PI (DuPont)Layers4 LayersThickness0.25mmCopper0.5 ozSurface FinishENIGIndustryWearables
2-Layer Automotive Steering Wheel FPC

2-Layer Automotive Steering Wheel FPC

MaterialAdhesiveless PI (Panasonic)Layers2 LayersThickness0.2mmCopper1 ozSurface FinishENIGIndustryAutomotive Electronics
3-Layer Print Head Dynamic FPC

3-Layer Print Head Dynamic FPC

MaterialAdhesiveless PI + RA copperLayers3 LayersThickness0.2mmCopper0.5 ozSurface FinishElectroplated GoldIndustryOffice Equipment
6-Layer Mechanical Keyboard FPC

6-Layer Mechanical Keyboard FPC

MaterialAdhesiveless PI (DuPont)Layers6 LayersThickness0.3mmCopper1 ozSurface FinishENIGIndustryComputer Peripherals

Manufacturing Capabilities

Standard manufacturing capability range for this product line. Contact our engineers to evaluate special requirements.

Layer Count1 - 6 layers
Base MaterialPI / PET
Base Thickness0.05 - 0.2 mm
Min. Trace/Space3/3 mil
Bend RadiusDynamic ≥ 6x thickness / static ≥ 3x
StiffenersPI / FR4 / steel + PSA adhesive backing
Surface FinishENIG / electroplated gold / selective gold
Impedance ControlSupported (differential / single-ended)
Min. Hole Size0.15 mm
Dynamic Flex Life100,000+ cycles (typical for adhesiveless PI)

Lead Time & Pricing Highlights

Bend it, fold it, fit it

Dynamic Bending

Bend-radius-optimized stack-ups rated for millions of flex cycles.

Ultra Thin

0.05-0.2mm flex base materials for space-critical assemblies.

Rigid-Flex

Rigid-flex combinations remove connectors and improve reliability.

Typical Applications

Consumer Electronics

Camera, display and battery flex assemblies in phones.

Wearables & Medical

Health bands and wearable sensors that conform to curved surfaces.

Automotive Electronics

Steering wheel, lidar and dashboard flex circuits.

Robotics

Continuous-motion circuits for joints and robot arms.

From Gerber to delivery in four steps

01

Upload Files

Send Gerber/ODB++ and stack-up table; standard boards get instant pricing.

02

Review & Quote

Complex boards get an engineer review before quoting.

03

Confirm Production

Confirm specs and price, pay online, and your boards enter the production queue.

04

Test & Deliver

Flying probe/fixture testing on every board with reports, shipped worldwide.

Further Reading

For more PCB process knowledge and technical practice, visit our blog center.

View All Articles

Frequently Asked Questions

For dynamic bending, keep the radius at least 6x the total thickness; for static bending 3x is generally safe.
Yes. PI/FR4/steel stiffeners and adhesive PSA backing are available as options.
Yes. Rigid-flex boards require a stack-up review with our engineers - see the Rigid-Flex product line for details.
Spaced panelization and breakout-tab (stamp-hole) panelization are common; stiffeners can be pre-assembled. Prototypes can ship as single pieces.
Yes. Single-ended and differential impedance control are supported - provide your stack-up requirements and we will attach an impedance test report.
Mechanical holes down to 0.15mm and 3/3 mil trace/space; HDI FPC supports laser microvias.

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