Industry Challenges
Cost-optimized HDI, FPC and high-layer boards for wearables and smart home devices.
Miniaturization
0.1mm microvias, fine lines and sub-0.4mm pitch BGAs.
Tight Cost Targets
Consumer price points leave no margin for over-engineering.
Fast Market Windows
Product launches wait for no one — lead time is critical.
How We Support You
Volume HDI Lines
Mass-production HDI with stable yields and competitive pricing.
FPC & Rigid-Flex
Single/double-sided FPC to multilayer rigid-flex, built in house.
Rapid Iteration
Prototype-to-mass in one pipeline — no re-qualification loops.