Industry Challenges
High-reliability PLC, drive and sensor boards built for harsh environments.
High Power Density
Higher copper weight and optimized layout for high-current paths.
Large Panel Sizes
Oversized boards up to 500×500mm with flatness control.
Long Life Cycles
10+ year service life demands conservative process margins.
How We Support You
Copper Weight & Thermal Processes
Thicker copper foil and resin-filled copper vias for power paths.
Thick Boards to 3.2mm+
Multilayer thick boards with reliable hole copper plating.
Frame Agreements & Stock
Scheduled deliveries and buffer stock for long product cycles.